VPC-3588 Motherboard
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Slug: vpc-3588

Tags: hardware>rockchip

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#VPC-3588 Mainboard Specification

#Changelog

  • 1.0.0 — 2023-04-24: Chinese and English merged version.
  • 1.0.1 — 2023-05-26: Reset button update to the mainboard picture; increased system interface definitions.
  • 1.1.0 — 2023-06-16: Updated based on V2.0 hardware version.
  • 1.1.1 — 2023-08-07: Updated description of the extended serial port and PCIe×4 hard disk slot.

#Contents

  1. RK3588 Brief
  2. Product Overview
  3. Specification List
  4. Interface Definition
  5. Physical Size
  6. Assemble Precautions
  7. Software Guide

#1. RK3588 Brief

  • CPU: Octa-core 64-bit big.LITTLE (4× Cortex-A76 + 4× Cortex-A55), up to 2.4 GHz (8 nm).
  • GPU: ARM Mali-G610 MC4; supports OpenGL ES 1.1/2.0/3.1/3.2, OpenCL 1.1/1.2/2.0, Vulkan 1.1/1.2; 2D acceleration.
  • NPU: 6 TOPS; supports INT4/INT8/INT16/FP16/BF16/TF32.
  • Multimedia: Decode H.265/H.264/AV1/VP9/AVS2 up to 8K@60 fps; encode H.264/H.265 up to 8K@30 fps.
  • Display: Multi-display up to 8K@60 fps; interfaces: eDP/DP/HDMI 2.1/MIPI.
  • Video input: MIPI CSI-2 (4×4 lanes or 4×2 + 2×4 lanes) and DVP; 32 MP ISP with HDR/3DNR; HDMI 2.0 input up to 4K@60 fps.
  • High-speed I/O: PCIe 3.0/2.0, SATA 3.0, RGMII, USB Type-C, USB 3.1/2.0. Note: CPU internal features; board support depends on described interfaces.

#2. Product Overview

The VPC-3588 mainboard uses Rockchip RK3588 (low-power, high-performance) with 4×A76 + 4×A55 and Mali-G610 MC4 up to 2.4 GHz. It supports 8K@60 fps decode and 8K@60 fps output. The compact design targets ultra-thin applications, integrating easily into final products such as digital signage, touch systems, consumer electronics, and entertainment systems.

#3. Specification List

Function / Interface Detailed Description
CPU RK3588 (4×A76 + 4×A55), up to 2.4 GHz
DDR LPDDR4 2 GB (options: 4/8/16/32 GB)
Storage On-board eMMC 16 GB (scalable to 128 GB)
LVDS 30-pin dual LVDS (VESA/JEITA) up to 1080p
MIPI-DSI 31-pin FPC up to 1920×1200
HDMI Output HDMI 2.1 up to 8K
HDMI Input HDMI 2.0/1.4b up to 1080p@60
eDP 20-pin, 1–4 lanes up to 4K@60 (optional)
VGA Output DB-15 + 9-pin header up to 1080p
4K LCD (VBO) 51-pin VBO display interface
Amplifier Output Dual 6 W @ 8 Ω
Headphone Out Stereo (3.5 mm jack)
MIC In Differential MIC (3.5 mm jack)
USB 4 horizontal (USB 3.0 Host×3 + USB 3.0 OTG×1), 1 vertical USB 3.0; 7 pin-headers (USB 2.0 Hub×6 + USB 2.0 Host×1 direct)
Serial Ports 1× TTL; 2× TTL/RS-232/RS-485; 2× TTL/RS-232; 4× extended TTL/RS-232
Camera USB camera up to 8 MP
Wi-Fi SDIO Wi-Fi 6 (802.11a/b/g/n/ac/ax), 2.4/5 GHz
Bluetooth Serial BT supporting v2.1+EDR/v3.0/v3.0+HS/v4.0/v5.0
Ethernet 1× RJ45 10/100/1000M + 4-pin PoE header
m-PCIe 4G 1× industry-standard m-PCIe
Backlight Control 2× headers (LVDS & eDP) with on/off and brightness control
GPIO Up to 8× GPIO (3.3 V)
I²C Bus I²C header (e.g., capacitive touch)
Security 1× Tamper port
mSATA 1× standard mSATA
SATA 4× SATA 3.0 + power headers
PCIe SSD 1× 64-pin splint PCIe x4 hard-disk socket (optional)
RTC CR1220, low-power RTC with timer/alarm
LED Red: standby; Green: running
Fans SYS fan power; CPU fan power
Buttons Recovery, Power, Reset
DC Input 9–15 V DC
Environment −20 °C to 70 °C; 0–95% RH (non-condensing)
Size 170×170×17 mm; PCB top height 15.5 mm
OS Android 12; Linux Qt / Ubuntu 20.04 / Debian 11

#4. Interface Definition

#J1 — DC-12 V Socket

  • Barrel jack: positive outer, negative inner; inner pin Ø 2.0 mm, outer ring Ø 5.5 mm.

#J2 — Micro-SIM Card Socket

  • Standard Micro-SIM. Insert with the gap facing outward.

#J3 — SATA Power Supply Header 2 (SIP 2.0 mm; square pad = Pin 1)

Pin Definition Note
1 12V Power output 12 V
2 GND Power ground
3 GND Power ground
4 5V Power output 5 V
Note: Max output current for 12 V and 5 V is ≤ 1 A. For 3.5″ HDDs, use external power if needed.    

#J4 — SATA Power Supply Header 1 (SIP 2.0 mm; square pad = Pin 1)

Pin Definition Note
1 12V Power output 12 V
2 GND Power ground
3 GND Power ground
4 5V Power output 5 V
Note: Same current limits as J3.    

#J5 — I²C Bus Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition Note
1 GND Digital ground
2 INT Interrupt in (3.3 V)
3 SDA I²C data
4 SCL I²C clock
5 RST Mainboard reset out (3.3 V)
6 3V3 +3.3 V power out

#J6 — m-PCIe 4G Socket

  • Standard m-PCIe 4G; USB signals sourced from Hub USB-6.

#J7 — 3-Pole Headphone Out (CTIA 3.5 mm)

  • Supports insert detection for speaker mute.

#J8 — CAN Header 0 (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 VSS (DGND)
2 L (Data)
3 H (Data)
4 VCC (default 3.3 V; 5 V optional)
Note: Software interface can0. Requires U9500 populated.  

#J9 — Speaker Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 R+
2 R−
3 L−
4 L+

#J10 — HDMI Output

  • Standard HDMI out.

#J12 — CAN Header 1 (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 VSS (DGND)
2 L (Data)
3 H (Data)
4 VCC (default 3.3 V; 5 V optional)
Note: Software interface can1. Populate U9828. For dual CAN, populate U9500 (CAN0) + U9828 (CAN1).  

#J13 — KIO Keypad Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 3V3
2 K1 (GPIO #152)
3 K2 (GPIO #153)
4 K3 (GPIO #154)
5 K4 (GPIO #155)
6 K5 (GPIO #156)
7 K6 (GPIO #157)
8 K7 (GPIO #129)
9 K8 (GPIO #130)
10 GND

#J14 — Front Panel Header (DIP 2.54 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 HD+ (Run LED +) 2 LED+ (Power LED +)
3 HD− (Run LED −) 4 LED− (Power LED −)
5 RES− 6 PW−
7 RES+ 8 PW+
9 GND 10 Null

#J15 — LVDS Header (DIP 2.0 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 VLCD 2 VLCD
3 VLCD 4 GND
5 GND 6 GND
7 RXO0− 8 RXO0+
9 RXO1− 10 RXO1+
11 RXO2− 12 RXO2+
13 GND 14 GND
15 RXOC− 16 RXOC+
17 RXO3− 18 RXO3+
19 RXE0− 20 RXE0+
21 RXE1− 22 RXE1+
23 RXE2− 24 RXE2+
25 GND 26 GND
27 RXEC− 28 RXEC+
29 RXE3− 30 RXE3+

#J17 — PoE PD Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 CT1 (Transformer Center 1)
2 CT2
3 CT3
4 CT4
Note: Power for the PoE receiver comes via J61 (Ethernet). Requires external PoE PD board to convert to 12 V. Supported: 1/2(+) & 3/6(−) or 4/5(+) & 7/8(−).  

#J18 — HDMI Input

  • Standard HDMI input.

#J19 — LVDS Backlight Control (SIP 2.0 mm; square pad = Pin 1)

Pin Definition Note
1 12V If > 2 A, use external 12 V
2 12V If > 2 A, use external 12 V
3 EN Default output 5 V
4 ADJ 3.3 V square wave (1 kHz)
5 GND Power ground
6 GND Power ground

#J20 — eDP Header (DIP 2.0 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 VLCD 2 VLCD
3 GND 4 GND
5 TX0− 6 TX0+
7 TX1− 8 TX1+
9 TX2− 10 TX2+
11 TX3− 12 TX3+
13 GND 14 GND
15 AUX− 16 AUX+
17 GND 18 GND
19 3.3V 20 NC

#J21 — eDP VLCD Voltage Select (DIP 2.0 mm; square pad = Pin 1)

  • Short 1–2 → VLCD @ 12 V (J20)
  • Short 3–4 → VLCD @ 5 V (J20)
  • Short 5–6 → VLCD @ 3.3 V (J20) Set according to panel requirements. Incorrect settings may damage panel/board.

#J22 — Wi-Fi Antenna IPEX

  • Standard IPEX 3 dBi connector (⌀ 2.0 mm).

#J23 — MIPI Panel FPC (FPC-0.3 mm, 31-pin, Top/Bottom contact)

Pin Definition Pin Definition
1 LED+ 2 LED+
3 LED+ 4 NC
5 LED− 6 LED−
7 LED− 8 LED−
9 GND 10 GND
11 MIPI_D2P 12 MIPI_D2N
13 GND 14 MIPI_D1P
15 MIPI_D1N 16 GND
17 MIPI_CKP 18 MIPI_CKN
19 GND 20 MIPI_D0P
21 MIPI_D0N 22 GND
23 MIPI_D3P 24 MIPI_D3N
25 GND 26 VDD-1V8 (default NC; fit R9232 = 0 Ω to enable)
27 RESET (1.8 V) 28 GND
29 VDD-1V8 30 VDD-3V3
31 VDD-3V3    
Backlight current default ≈ 160 mA. With (200/160)×2 ≈ 2.5 Ω, use 2× 2.49 Ω 0603 for R117 and R9223.      

#J24 — eDP Backlight Control (SIP 2.0 mm; square pad = Pin 1)

Pin Definition Note
1 12V If > 2 A, use external 12 V
2 12V If > 2 A, use external 12 V
3 EN Default output 5 V
4 ADJ 3.3 V square wave (1 kHz)
5 GND Power ground
6 GND Power ground

#J25 — DC-12 V Input Header (SIP 2.54 mm; square pad = Pin 1)

Pin Definition
1 GND
2 GND
3 12V (input)
4 12V (input)
Same input as J1/J39.  

#J26 — VGA Output Jack

  • DB-15 VGA output.

#J27 — Dual-Tier LED

  • Lower LED: power; Upper LED: software-controlled activity.

#J29 — USB 2.0 DIP Header (DIP 2.54 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 5V 2 5V
3 D− 4 D−
5 D+ 6 D+
7 GND 8 GND
9 Null 10 GND
Hub×7 expansion of USB20_HOST1.      

#J30 — USB 2.0 DIP Header (DIP 2.54 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 5V 2 5V
3 D− 4 D−
5 D+ 6 D+
7 GND 8 GND
9 Null 10 GND
Hub×7 expansion of USB20_HOST1.      

#J31 — USB 2.0 Host Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 GND
2 D+
3 D−
4 5V
Hub×7 expansion of USB20_HOST1.  

#J33 — USB 2.0 Host Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 GND
2 D+
3 D−
4 5V
Hub×7 expansion of USB20_HOST1.  

#J34 — USB 2.0 Host Direct (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 GND
2 D+
3 D−
4 5V
Direct from USB20_HOST0.  

#J35 — Double USB 3.0 Type-A

#J36 — USB 3.0 Type-A

#J37 — Dual USB 3.0 Type-A

  • Note (J37): Upper port = OTG pass-through (default firmware flashing/debug); Lower port = USB 3.0 1×4 Hub group.

#J38 — LVDS VLCD Voltage Select (DIP 2.0 mm; square pad = Pin 1)

  • Short 1–2 → VLCD @ 12 V (J15)
  • Short 3–4 → VLCD @ 5 V (J15)
  • Short 5–6 → VLCD @ 3.3 V (J15) Set per panel; incorrect settings can cause damage.

#J39 — DC-12 V Input Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 12V DC in (9–15 V)
2 12V DC in (9–15 V)
3 GND
4 GND

#J40 — mSATA Socket

  • Standard mSATA module support.

#J41 — SYS Fan Power (SIP 2.0 mm; square pad = Pin 1, GPIO #76 low-active)

Pin Definition
1 GND
2 12V (switched)

#J42 — CPU Fan Power (SIP 2.0 mm; square pad = Pin 1, GPIO #77 low-active)

Pin Definition
1 GND
2 12V (switched)

#J43–J46 — SATA Data Sockets 1–4

  • Standard 7-pin SATA data.

#J47 — MIC-IN Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 DET (Mic detect)
2 MIC-R (Right)
3 GND

#J48 — VBO 4K LCD Cable Socket

  • I-PEX, 0.5 mm, 51-pin (bottom contact; square pad = Pin 1).

#J49 — Tamper Header (SIP 2.0 mm; square pad = Pin 1)

Pin Definition
1 − (Line cathode)
2 + (High/low input; read 1/0; SW GPIO #10)

#J50 — Data Serial Port 0 (SIP 2.0 mm; square pad = Pin 1)

  • Default level: RS-485; configurable to TTL/RS-232. RS-232 if U9825 mounted; RS-485 if U9858 mounted. Device node: /dev/ttyS0. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX|A (TTL/RS-232/RS-485) | | 3 | TX|B (TTL/RS-232/RS-485) | | 4 | VCC (3.3 V default; 5 V option) |

#J51 — Data Serial Port 2 (SIP 2.0 mm; square pad = Pin 1)

  • Level: TTL only. Device node: /dev/ttyS2. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL) | | 3 | TX (TTL) | | 4 | VCC (3.3 V default; 5 V option) | Note: If repurposing the debug UART, custom software is required. Startup logs are output for the first ~5 s at power-on; peer must handle this.

#J52 — Data Serial Port 3 (SIP 2.0 mm; square pad = Pin 1)

  • Default level: TTL; configurable to RS-232/RS-485. RS-232 if U9825; RS-485 if U9823. Device node: /dev/ttyS3. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX|A (TTL/RS-232/RS-485) | | 3 | TX|B (TTL/RS-232/RS-485) | | 4 | VCC (3.3 V default; 5 V option) |

#J53 — Data Serial Port 5 (SIP 2.0 mm; square pad = Pin 1)

  • Default level: RS-232; configurable to TTL (RS-232 if U9826). Device node: /dev/ttyS5. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J54 — Data Serial Port 8 (SIP 2.0 mm; square pad = Pin 1)

  • Default level: RS-232; configurable to TTL (RS-232 if U9826). Device node: /dev/ttyS8. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J55 — Extended Serial Port 1 (SIP 2.0 mm; square pad = Pin 1)

  • TTL 3.3 V optional; configurable to RS-232 (U36). Device node: /dev/ttyP0. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J56 — Extended Serial Port 2 (SIP 2.0 mm; square pad = Pin 1)

  • TTL 3.3 V optional; configurable to RS-232 (U36). Device node: /dev/ttyP1. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J57 — Extended Serial Port 3 (SIP 2.0 mm; square pad = Pin 1)

  • TTL 3.3 V optional; configurable to RS-232 (U37). Device node: /dev/ttyP2. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J58 — Extended Serial Port 4 (SIP 2.0 mm; square pad = Pin 1)

  • TTL 3.3 V optional; configurable to RS-232 (U37). Device node: /dev/ttyP3. | Pin | Definition | |—:|—| | 1 | GND | | 2 | RX (TTL/RS-232) | | 3 | TX (TTL/RS-232) | | 4 | VCC (3.3 V default; 5 V option) |

#J59 — MIC-IN Jack

  • 3.5 mm; supports 2-segment and 3-segment microphones.

#J60 — Audio Extension Interface (Front-panel audio; DIP 2.54 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 MIC-L 2 GND
3 MIC-R 4 SENSE
5 HP-R 6 MIC-DEL
7 GND 8 Null
9 HP-L 10 HP-DEL

#J61 — RJ45 Internal Gigabit Ethernet

  • Internal RJ45 jack.

#J62 — VGA Output Header (DIP 2.54 mm; square pad = Pin 1)

Pin Definition Pin Definition
1 RED 2 GND
3 GRN 4 GND
5 BLUE 6 GND
7 HS 8 DATA
9 VS 10 CLK

#PCIe×4 — 64-Pin Splint Hard-Disk Socket

  • PCIe x4 slot mainly for PCIe SSD expansion.

#Recovery Mode Button (SW1)

  • Hold ~3 s during power-on to enter recovery.

#System Reset Button (SW2)

  • Click to reboot.

#5. Physical Size

  • PCB: 170 mm × 170 mm; mounting hole Ø 3.3 mm.
  • For detailed dimensions, request the DXF from the manufacturer.

#6. Assemble Precautions

  1. Relative humidity: 10–90%, non-condensing.
  2. Operating temperature: −20 °C to 70 °C.
  3. Storage temperature: −40 °C to 70 °C.
  4. Use ESD protection during assembly/transport.
  5. Keep interface cables short to maintain signal integrity.
  6. Do not bend or stress the board during assembly.
  7. Avoid shorts between the mainboard and peripherals.
  8. For LVDS/eDP panels: verify panel voltage/current and connector Pin-1 orientation.
  9. For backlight: verify required voltage and current.
  10. For USB/GPIO/Serial/I²C/SPI/HDMI, ensure peripheral I/O levels and current are compatible. Power pins on general headers ≤ 100 mA; USB power pins ≤ 500 mA.
  11. Supply power via the power input jack/header and size current budget for total peripherals. Do not power from the backlight connector.
  12. Communication modules should be ≥ 5 mm from metal housings to reduce interference.

#7. Software Guide

  • The mainboard supports dual/triple-display combinations among LVDS/eDP/MIPI/HDMI/VGA. For specific multi-display combos, obtain the corresponding patches from the manufacturer.

Serial device nodes:

Port Device Node
J50 /dev/ttyS0
J51 /dev/ttyS2
J52 /dev/ttyS3
J53 /dev/ttyS5
J54 /dev/ttyS8
J55 /dev/ttyP0 or /dev/ttyS10
J56 /dev/ttyP1 or /dev/ttyS11
J57 /dev/ttyP2 or /dev/ttyS12
J58 /dev/ttyP3 or /dev/ttyS13
URL: https://ib.bsb.br/vpc-3588